Inventor

RIGG SIDNEY B

US31 patents

⚠️ This page may combine multiple inventors who share the name “RIGG SIDNEY B”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

RIGG SIDNEY B

MICRON TECHNOLOGY INC

Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices

Methods of forming blind wafer interconnects

Microelectronics devices, having vias, and packaged microelectronic devices having vias

Through-wafer interconnects for photoimager and memory wafers

Microelectronic devices and methods for forming interconnects in microelectronic devices

Chemical mechanical polishing methods

Microelectronic devices and methods for forming interconnects in microelectronic devices

Methods of forming blind wafer interconnects, and related structures and assemblies

Microelectronic devices and methods for forming interconnects in microelectronic devices

Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices

Prefabricated housings for microelectronic imagers

Microelectronic imagers and methods of packaging microelectronic imagers

Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers

Through-wafer interconnects for photoimager and memory wafers

Through-wafer interconnects for photoimager and memory wafers

Methods for fabricating and filling conductive vias and conductive vias so formed

Methods for thinning semiconductor substrates that employ support structures formed on the substrates

Microelectronic imagers and methods of packaging microelectronic imagers

Microelectronic devices and methods for forming interconnects in microelectronic devices

Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers

Methods for packaging microelectronic imagers

Chemical mechanical polishing methods

Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates

AKRAM SALMAN

Through-wafer interconnects for photoimager and memory wafers

Methods of forming conductive vias

Semiconductor dice including at least one blind hole, wafers including such semiconductor dice, and intermediate products made while forming at least one blind hole in a substrate

Semiconductor dice including at least one blind hole, wafers including such semiconductor dice, and intermediate products made while forming at least one blind hole in a substrate

Methods for fabricating and filling conductive vias and conductive vias so formed

APTINA IMAGING CORP

Microelectronic imaging units and methods of manufacturing microelectronic imaging units at the wafer level

Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers

Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers