Inventor
ALUR SIDDHARTH
US3 patents
Patents
3 patentsUS11508636B2Nov 22, 2022
Multi-layer solution based deposition of dielectrics for advanced substrate architectures
INTEL CORP0 citations59
US11196165B2Dec 7, 2021
Low z-height, ultra-low dielectric constant air cavity based and multi-core/highly asymmetric antenna substrate architectures for electrical performance improvements in 5G mm-wave applications
INTEL CORP0 citations55
US12334447B2Jun 17, 2025
Lithographically defined vertical interconnect access (VIA) for a bridge die first level interconnect (FLI)
INTEL CORP0 citations48