Inventor

PRESSEL KLAUS

DE20 patents

⚠️ This page may combine multiple inventors who share the name “PRESSEL KLAUS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PRESSEL KLAUS

INFINEON TECHNOLOGIES AG

Semiconductor packages with integrated antenna and method of forming thereof

Stacked semiconductor chips

Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chips

Semiconductor module comprising components for microwave engineering in plastic casing and method for the production thereof

Flexible rewiring plate for semiconductor components, and process for producing it

Connector block with two sorts of through connections, and electronic device comprising a connector block

Semiconductor module including components in plastic casing

Semiconductor device for radio frequencies of more than 10 GHz and method for producing the device

Method for fabricating a semiconductor flip-chip package

Singulating semiconductor wafers to form semiconductor chips

Method of manufacturing a stacked die module

Semiconductor substrate with strip conductors formed of carbon nanotubes and production thereof

PRESSEL KLAUS

Embedded chip package

Semiconductor device and manufacturing method

Semiconductor device and manufacturing method

INTEL MOBILE COMM GMBH

Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips

Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips

BRUNNBAUER MARKUS

Structure for electrostatic discharge in embedded wafer level packages

INTEL DEUTSCHLAND GMBH

Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips

MEYER THORSTEN

Method and system for routing electrical connections of semiconductor chips