Inventor
TOYAMA MUNEHIRO
JP12 patents
⚠️ This page may combine multiple inventors who share the name “TOYAMA MUNEHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
10 patentsUS7592202B2Sep 22, 2009
Embedding device in substrate cavity
INTEL CORP12 citations83
US7670951B2Mar 2, 2010
Grid array connection device and method
INTEL CORP8 citations81
US7875503B2Jan 25, 2011
Reducing underfill keep out zone on substrate used in electronic device processing
INTEL CORP11 citations79
US7915060B2Mar 29, 2011
Grid array connection device and method
INTEL CORP6 citations71
US9966351B2May 8, 2018
Grid array connection device and method
INTEL CORP2 citations70
US9449936B2Sep 20, 2016
Grid array connection device and method
INTEL CORP2 citations60
US8362627B2Jan 29, 2013
Reducing underfill keep out zone on substrate used in electronic device processing
INTEL CORP3 citations58
US7432202B2Oct 7, 2008
Method of substrate manufacture that decreases the package resistance
INTEL CORP4 citations58
US10741515B2Aug 11, 2020
Grid array connection device and method
INTEL CORP0 citations49
US10373924B2Aug 6, 2019
Grid array connection device and method
INTEL CORP0 citations49