Inventor

LIN JEN-CHIEH

CN33 patents

⚠️ This page may combine multiple inventors who share the name “LIN JEN-CHIEH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN JEN-CHIEH

CORNING INC

Bendable glass stack assemblies, articles and methods of making the same

Bezel-free display tile with edge-wrapped conductors and methods of manufacture

Bezel-free display tile with edge-wrapped conductors and methods of manufacture

Silica content substrate such as for use harsh environment circuits and high frequency antennas

Thin glass or ceramic substrate for silicon-on-insulator technology

Article for improved light extraction

Processes for making light extraction substrates for an organic light emitting diode using photo-thermal treatment

Glass wafers for semiconductor device fabrication

Temporary bonding using polycationic polymers

UNITED MICROELECTRONICS CORP

Method for manufacturing semiconductor device and device manufactured by the same

Method for forming semiconductor integrated circuit structure

Semiconductor integrated circuit structure

Method for improving wafer surface uniformity

Semiconductor integrated circuit structure and method for forming the same

Semiconductor process

Metal gate structure and fabrication method thereof

Planarization method

BAYER MATERIALSCIENCE AG

Polyurethane composite, its preparation and use

Isocyanate-terminated prepolymer, the method for preparing the same and the use thereof

COVESTRO INTELLECTUAL PROPERTY GMBH & CO KG

Modified monooxygenases for the manufacture of hydroxylated hydrocarbons based on substitution of amino acids by alanine

Modified monooxygenases for the manufacture of hydroxylated hydrocarbons

GLOBALWAFERS CO LTD

Polishing head assembly having recess and cap

Polishing head assembly having recess and cap

TSAI HSIAO-CHUNG

Immunoassay devices and methods of using same

GLASGOW LOUIS CHARLES

Polymeric fused thiophene semiconductor formulation

CHUNGHWA PICTURE TUBES LTD

Manufacturing method of thin film transistor array substrate

CHENG TSUN-MIN

Metal gate structure and fabrication method thereof

TSAO WEI-CHE

Method for manufacturing through-silicon via

TATUNG CO

Interpolation method for enlarging an image

HEALTH & LIFE CO LTD

Audio player device, and method for automatically adjusting an output volume of the audio player device

IND TECH RES INST

Copper metallization for through-glass vias on thin glass

HIMAX TECH LTD

Method for improving touch performance of capacitive touch screen with non-rectangular shape

HSIEH YA-HSUEH

Planarization method applied in process of manufacturing semiconductor component