Inventor

LIN TA-HAN

TW2 patents

Patents

2 patents

US9686866B2Jun 20, 2017

Package structure and manufacturing method thereof

UNIMICRON TECHNOLOGY CORP2 citations65

US9433108B2Aug 30, 2016

Method of fabricating a circuit board structure having an embedded electronic element

UNIMICRON TECHNOLOGY CORP0 citations29