Inventor
WYATT DEREK
US2 patents
Patents
2 patentsUS9688892B2Jun 27, 2017
Underfill composition and packaging process using the same
Henkel IP & Holding GmbH2 citations61
US10985108B2Apr 20, 2021
Compositions for gap coating and/or filling in or between electronic packages by capillary flow and methods for the use thereof
Henkel IP & Holding GmbH0 citations53