Inventor

CHEN WEI-YU

TW625 patents

⚠️ This page may combine multiple inventors who share the name “CHEN WEI-YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEN WEI-YU

LARGAN PRECISION CO LTD

Photographing optical lens system, image capturing unit and electronic device

Imaging lens assembly

Photographing system, image capturing unit and electronic device

Photographing optical lens assembly, image capturing unit and electronic device

Photographing optical lens assembly, image capturing unit and electronic device

Image capturing apparatus

Optical image capturing lens assembly

Photographing optical lens system, image capturing unit and electronic device

Photographing optical lens assembly, image capturing unit and electronic device

Optical photographing lens assembly, image capturing device and electronic device

Optical lens assembly, image capturing apparatus and electronic device

Image capturing optical system, image capturing device and electronic device

Image capturing lens system

Wide-angle image capturing lens assembly

Optical image capturing system, image capturing device and electronic device

Optical lens system, image capturing unit and electronic device comprising nine lenses of various refractive powers, or ten lenses of -+--+-+-+- or ++--+-+-+- refractive powers

Image capturing lens assembly, imaging apparatus and electronic device

Photographing lens assembly, imaging apparatus and electronic device

Photographing optical lens assembly, image capturing unit and electronic device

Photographing lens assembly, imaging apparatus and electronic device

Optical imaging lens assembly, image capturing unit and electronic device

Photographing optical lens assembly, imaging apparatus and electronic device

Photographing system, image capturing unit and electronic device

TAIWAN SEMICONDUCTOR MFG CO LTD

Chip package structure with bump and method for forming the same

Integrated circuit package pad and methods of forming

Devices employing thermal and mechanical enhanced layers and methods of forming same

Integrated fan-out packages and methods of forming the same

Semiconductor device and method of manufacture

Semiconductor device and method of manufacture

Chip package structure with molding layer and method for forming the same

Chip package structure with bump

Methods of forming connector pad structures, interconnect structures, and structures thereof

Dicing in wafer level package

Integrated circuit package pad and methods of forming

Photonic integrated package and method forming same

Chip package structure with molding layer and method for forming the same

Package structure, die and method of manufacturing the same

Integrated fan-out packages with embedded heat dissipation structure

ASUSTEK COMP INC

Method and apparatus for improving retransmission scheduling of sidelink communication in a wireless communication system

Method and apparatus of selecting bandwidth part for random access (RA) procedure in a wireless communication system

Method and apparatus for sidelink resource allocation mode configuration in a wireless communication system

Method and apparatus of deriving feedback resource for sidelink transmission in a wireless communication system

Method and apparatus for handling sidelink feedback collision in a wireless communication system

Method and apparatus for deciding numerology in a wireless communication system

Method and apparatus for reducing interruption of beaming recovery procedure in a wireless communication system

Method and apparatus for improving one-to-one sidelink communication in a wireless communication system

Method and apparatus of handling interest indication in a wireless communication system

TSAI TSUNG-HAN

Optical image capturing lens system

ADVANCED SEMICONDUCTOR ENG

Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and method of manufacturing the same

TSAI MIN-CHUAN

Semiconductor structure and process thereof