Inventor
HUANG JUN-LUNG
TW4 patents
Patents
4 patentsUS6753260B1Jun 22, 2004
Composite etching stop in semiconductor process integration
TAIWAN SEMICONDUCTOR MFG29 citations91
US7122484B2Oct 17, 2006
Process for removing organic materials during formation of a metal interconnect
TAIWAN SEMICONDUCTOR MFG19 citations90
US7042049B2May 9, 2006
Composite etching stop in semiconductor process integration
TAIWAN SEMICONDUCTOR MFG2 citations61
US6884728B2Apr 26, 2005
Method for removing polymeric residue contamination on semiconductor feature sidewalls
TAIWAN SEMICONDUCTOR MFG4 citations59