Inventor
GRIFFIN AMY R
US6 patents
Patents
6 patentsUS12588502B2Mar 24, 2026
Methods and apparatus for integrating carbon nanofiber into semiconductor devices using W2W fusion bonding
MICRON TECHNOLOGY INC0 citations60
US12582001B2Mar 17, 2026
Methods for fusion bonding semiconductor devices to temporary carrier wafers with cavity regions for reduced bond strength, and semiconductor device assemblies formed by the same
MICRON TECHNOLOGY INC0 citations60
US11385281B2Jul 12, 2022
Heat spreaders for use in semiconductor device testing, such as burn-in testing
MICRON TECHNOLOGY INC0 citations60
US11011452B2May 18, 2021
Heat spreaders for semiconductor devices, and associated systems and methods
MICRON TECHNOLOGY INC1 citations60
US12078672B2Sep 3, 2024
Heat spreaders for use in semiconductor device testing, such as burn-in testing
MICRON TECHNOLOGY INC0 citations55
US11372043B2Jun 28, 2022
Heat spreaders for use in semiconductor device testing, such as burn-in testing
MICRON TECHNOLOGY INC0 citations55