Inventor
RUBENS PAUL A
US3 patents
Patents
3 patentsUS5825625AOct 20, 1998
Heat conductive substrate mounted in PC board for transferring heat from IC to heat sink
HEWLETT PACKARD CO89 citations94
US6018193AJan 25, 2000
Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink
HEWLETT PACKARD CO23 citations87
US5960535AOct 5, 1999
Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink
HEWLETT PACKARD CO32 citations87