Inventor
KULKARNI DEEPAK
US25 patents
⚠️ This page may combine multiple inventors who share the name “KULKARNI DEEPAK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
14 patentsUS9269701B2Feb 23, 2016
Localized high density substrate routing
INTEL CORP49 citations98
US9153552B2Oct 6, 2015
Bumpless build-up layer package including an integrated heat spreader
INTEL CORP43 citations97
US8912670B2Dec 16, 2014
Bumpless build-up layer package including an integrated heat spreader
INTEL CORP53 citations97
US9679843B2Jun 13, 2017
Localized high density substrate routing
INTEL CORP17 citations92
US10366951B2Jul 30, 2019
Localized high density substrate routing
INTEL CORP7 citations84
US9520376B2Dec 13, 2016
Bumpless build-up layer package including an integrated heat spreader
INTEL CORP11 citations83
US11990427B2May 21, 2024
Chiplet first architecture for die tiling applications
INTEL CORP2 citations73
US11973041B2Apr 30, 2024
Chiplet first architecture for die tiling applications
INTEL CORP2 citations73
US11769735B2Sep 26, 2023
Chiplet first architecture for die tiling applications
INTEL CORP1 citations73
US11515248B2Nov 29, 2022
Localized high density substrate routing
INTEL CORP2 citations73
US12308329B2May 20, 2025
Chiplet first architecture for die tiling applications
INTEL CORP0 citations62
US12107042B2Oct 1, 2024
Localized high density substrate routing
INTEL CORP0 citations62
US11984396B2May 14, 2024
Localized high density substrate routing
INTEL CORP0 citations62
US10796988B2Oct 6, 2020
Localized high density substrate routing
INTEL CORP0 citations52
IBM
5 patentsUS7820051B2Oct 26, 2010
Recycling of electrochemical-mechanical planarization (ECMP) slurries/electrolytes
IBM4 citations61
US8803318B2Aug 12, 2014
Semiconductor chips including passivation layer trench structure
IBM3 citations58
US7883395B2Feb 8, 2011
Electrical contact structures and methods for use
IBM0 citations51
US7807036B2Oct 5, 2010
Method and system for pad conditioning in an ECMP process
IBM1 citations51
US12455970B2Oct 28, 2025
Privacy preserving and high performance data clustering
IBM0 citations38
ATLASSIAN PTY LTD
3 patentsUS10354093B1Jul 16, 2019
Managing content authorization in a federated application system
ATLASSIAN PTY LTD13 citations78
US11675932B2Jun 13, 2023
Managing content authorization in a federated application system
ATLASSIAN PTY LTD0 citations57
US11263348B2Mar 1, 2022
Managing content authorization in a federated application system
ATLASSIAN PTY LTD0 citations57