Inventor

LANE MICHAEL W

US21 patents

⚠️ This page may combine multiple inventors who share the name “LANE MICHAEL W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LANE MICHAEL W

IBM

Using crack arrestor for inhibiting damage from dicing and chip packaging interaction failures in back end of line structures

Device and methodology for reducing effective dielectric constant in semiconductor devices

Device and methodology for reducing effective dielectric constant in semiconductor devices

Crackstop with release layer for crack control in semiconductors

Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer

Copper conductor

Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer

Device and methodology for reducing effective dielectric constant in semiconductor devices

SiCOH dielectric material with improved toughness and improved Si-C bonding

Method of forming crack trapping and arrest in thin film structures

Device and methodology for reducing effective dielectric constant in semiconductor devices

Method and structure to enhance temperature/humidity/bias performance of semiconductor devices by surface modification

Structure to improve adhesion between top CVD low-K dielectric and dielectric capping layer

BEOL interconnect structures with improved resistance to stress

Interlevel dielectric layer and metal layer sealing

Crack trapping and arrest in thin film structures

Semiconductor chips including passivation layer trench structure

LANE MICHAEL W

Flight attendant actuated warning system and method

Structure for inhibiting back end of line damage from dicing and chip packaging interaction failures

EDELSTEIN DANIEL C

Reducing effective dielectric constant in semiconductor devices

KULKARNI DEEPAK

Semiconductor chips including passivation layer trench structure