Inventor
HUANG BENLIH
US3 patents
Patents
3 patentsUS7749336B2Jul 6, 2010
Technique for increasing the compliance of tin-indium solders
INDIUM CORP AMERICA2 citations56
US7749340B2Jul 6, 2010
Technique for increasing the compliance of lead-free solders containing silver
INDIUM CORP AMERICA4 citations56
US6783057B2Aug 31, 2004
Anti-tombstoning solder alloys for surface mount applications
INDIUM CORP AMERICA0 citations38