Inventor

HWANG HONG-SIK

US2 patents

Patents

2 patents

US7749336B2Jul 6, 2010

Technique for increasing the compliance of tin-indium solders

INDIUM CORP AMERICA2 citations56

US7749340B2Jul 6, 2010

Technique for increasing the compliance of lead-free solders containing silver

INDIUM CORP AMERICA4 citations56