Inventor

CHUNG YUL-KYO

KR42 patents

⚠️ This page may combine multiple inventors who share the name “CHUNG YUL-KYO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHUNG YUL-KYO

SAMSUNG ELECTRO MECH

Fan-out semiconductor package

Method of fabricating printed circuit board having embedded multi-layer passive devices

Electronic component embedded substrate and manufacturing method thereof

Multi-layer board with decoupling function

Multilayered substrate and method of manufacturing the same

Method for manufacturing capacitor embedded in PCB

High-dielectric constant metal-ceramic-polymer composite material and method for producing embedded capacitor using the same

Circuit board and method of manufacturing the same

Printed circuit board including electronic component embedded therein and method for manufacturing the same

Substrate embedding passive element

Method for manufacturing a printed circuit board with a thin film capacitor embedded therein having a dielectric film by using laser lift-off, and printed circuit board with a thin film capacitor embedded therein manufactured thereby

Method of manufacturing component-embedded printed circuit board

Circuit board and method of manufacturing the same

Coating solution for forming high dielectric constant thin film and method for forming dielectric thin film using the same

Method for manufacturing a printed circuit board including an embedded electronic component

Substrate for camera module and camera module having the same

Method of manufacturing circuit board embedding thin film capacitor

Thin film-capacitor-embedded printed circuit board and method of manufacturing the same

Method for manufacturing printed circuit board with thin film capacitor embedded therein

Printed circuit board including embedded electronic component and method for manufacturing the same

Multilayered substrate

Multilayer ceramic capacitor and printed circuit board including the same

Substrate having electronic component embedded therein and method of manufacturing the same

Semiconductor package and method of manufacturing the same

Method for manufacturing a printed circuit board with a thin film capacitor embedded therein having a dielectric film by using laser lift-off, and printed circuit board with a thin film capacitor embedded therein manufactured thereby

Fan-out semiconductor package

Semiconductor chip having alignment mark and method of manufacturing the same

Coating solution for forming high dielectric constant thin film and method for forming dielectric thin film using the same

Coating solution for forming high dielectric constant thin film and method for forming dielectric thin film using the same

Printed circuit board with film capacitor embedded therein and method for manufacturing the same

Thin film capacitor, thin film capacitor-embedded printed circuit board and manufacturing method of thin film capacitor

Thin film capacitor-embedded printed circuit board and method of manufacturing the same

Passive device embedded in substrate and substrate with passive device embedded therein

JEONG JIN-SOO

Method of processing cavity of core substrate

CHUNG YUL-KYO

Semiconductor chip package and printed circuit board

KIM MOON-IL

PCB strip and manufacturing method for electronic component embedded PCB

LEE DOO HWAN

Semiconductor package and method of manufacturing the same

KIM HYUN-HO

Test method for passive device embedded printed circuit board

LIM SUNG-TAEK

Capacitor and manufacturing method thereof

BYUN JUNG-SOO

Electronics component embedded PCB

KIM HYUN HO

Circuit board and method for testing component built in the circuit board

RYU JONG IN

Embedded printed circuit board and manufacturing method thereof