Inventor
JIN HAN NA
KR4 patents
Patents
4 patentsUS11670518B2Jun 6, 2023
Method of manufacturing semiconductor package having connection structure with tapering connection via layers
SAMSUNG ELECTRONICS CO LTD7 citations78
US10796997B2Oct 6, 2020
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations71
US11088081B2Aug 10, 2021
Semiconductor package having a connection structure with tapering connection via layers
SAMSUNG ELECTRONICS CO LTD0 citations55
US10828871B2Nov 10, 2020
Carrier substrate and method of manufacturing semiconductor package using the same
SAMSUNG ELECTRONICS CO LTD0 citations45