Inventor
BASU DEBASHISH
US4 patents
Patents
4 patentsUS11145541B2Oct 12, 2021
Conductive via and metal line end fabrication and structures resulting therefrom
INTEL CORP5 citations71
US11652045B2May 16, 2023
Via contact patterning method to increase edge placement error margin
INTEL CORP0 citations53
US11211324B2Dec 28, 2021
Via contact patterning method to increase edge placement error margin
INTEL CORP0 citations53
US12368095B2Jul 22, 2025
Simultaneous filling of variable aspect ratio single damascene contact to gate and trench vias with low resistance barrierless selective metallization
INTEL CORP0 citations50