Inventor
PAN ALFRED I-TSUNG
US44 patents
⚠️ This page may combine multiple inventors who share the name “PAN ALFRED I-TSUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HEWLETT PACKARD DEVELOPMENT CO
28 patentsUS7622371B2Nov 24, 2009
Fused nanocrystal thin film semiconductor and method
HEWLETT PACKARD DEVELOPMENT CO72 citations98
US6620542B2Sep 16, 2003
Flex based fuel cell
HEWLETT PACKARD DEVELOPMENT CO62 citations96
US6588095B2Jul 8, 2003
Method of processing a device by electrophoresis coating
HEWLETT PACKARD DEVELOPMENT CO63 citations96
US7062848B2Jun 20, 2006
Printable compositions having anisometric nanostructures for use in printed electronics
HEWLETT PACKARD DEVELOPMENT CO58 citations95
US6982734B2Jan 3, 2006
Printing on electrically writable media and electrically writable displays
HEWLETT PACKARD DEVELOPMENT CO31 citations93
US7790074B2Sep 7, 2010
Stereolithographic method for forming three-dimensional structure
HEWLETT PACKARD DEVELOPMENT CO19 citations92
US6921593B2Jul 26, 2005
Fuel additives for fuel cell
HEWLETT PACKARD DEVELOPMENT CO21 citations92
US6977009B2Dec 20, 2005
Metal coated polymer electrolyte membrane having a reinforcement structure
HEWLETT PACKARD DEVELOPMENT CO16 citations91
US7129844B2Oct 31, 2006
Remote communications devices, wireless communications systems, remote communications device operable methods, and retail monitoring methods
HEWLETT PACKARD DEVELOPMENT CO11 citations84
US6707479B1Mar 16, 2004
Apparatus and methods of printing on an electrically writable medium
HEWLETT PACKARD DEVELOPMENT CO18 citations84
US6536875B1Mar 25, 2003
Actuator apparatus, process of forming thereof and method of actuation
HEWLETT PACKARD DEVELOPMENT CO13 citations84
US6800323B2Oct 5, 2004
Porously coated open-structure substrate and method of manufacture thereof
HEWLETT PACKARD DEVELOPMENT CO11 citations74
US6715859B2Apr 6, 2004
Thermal ink jet resistor passivation
HEWLETT PACKARD DEVELOPMENT CO9 citations74
US6656526B2Dec 2, 2003
Porously coated open-structure substrate and method of manufacture thereof
HEWLETT PACKARD DEVELOPMENT CO11 citations74
US6833212B2Dec 21, 2004
Electrolyte for a fuel cell
HEWLETT PACKARD DEVELOPMENT CO12 citations73
US7833616B2Nov 16, 2010
Self-aligning nanowires and methods thereof
HEWLETT PACKARD DEVELOPMENT CO4 citations63
US7361426B2Apr 22, 2008
Surface structure for enhancing catalyst reactivity and method of manufacturing thereof
HEWLETT PACKARD DEVELOPMENT CO4 citations63
US8029852B2Oct 4, 2011
Contact printing oxide-based electrically active micro-features
HEWLETT PACKARD DEVELOPMENT CO2 citations62
US7718545B1May 18, 2010
Fabrication process
HEWLETT PACKARD DEVELOPMENT CO2 citations62
US7371481B2May 13, 2008
Electrode having macropores and micropores therein
HEWLETT PACKARD DEVELOPMENT CO3 citations62
US7341680B2Mar 11, 2008
Printable composition with nanostructures of first and second types
HEWLETT PACKARD DEVELOPMENT CO6 citations62
US7597991B2Oct 6, 2009
Flex based fuel cell
HEWLETT PACKARD DEVELOPMENT CO0 citations52
US7554566B2Jun 30, 2009
Image development methods, hard imaging devices, and image members
HEWLETT PACKARD DEVELOPMENT CO0 citations52
US7163844B2Jan 16, 2007
Monolithic common carrier
HEWLETT PACKARD DEVELOPMENT CO0 citations52
US6812564B1Nov 2, 2004
Monolithic common carrier
HEWLETT PACKARD DEVELOPMENT CO0 citations52
US7435497B2Oct 14, 2008
Metal coated polymer electrolyte membrane having a reinforcement structure
HEWLETT PACKARD DEVELOPMENT CO1 citations51
US7255950B2Aug 14, 2007
Fuel delivery system and method of use thereof
HEWLETT PACKARD DEVELOPMENT CO0 citations31
US6659592B2Dec 9, 2003
Multiple redundant through hole electrical interconnects and method for forming the same
HEWLETT PACKARD DEVELOPMENT CO0 citations29
HEWLETT PACKARD CO
9 patentsUS6501663B1Dec 31, 2002
Three-dimensional interconnect system
HEWLETT PACKARD CO136 citations98
US6366468B1Apr 2, 2002
Self-aligned common carrier
HEWLETT PACKARD CO110 citations98
US5872582AFeb 16, 1999
Microfluid valve for modulating fluid flow within an ink-jet printer
HEWLETT PACKARD CO83 citations96
US6530649B1Mar 11, 2003
Hermetic seal in microelectronic devices
HEWLETT PACKARD CO41 citations92
US6460966B1Oct 8, 2002
Thin film microheaters for assembly of inkjet printhead assemblies
HEWLETT PACKARD CO50 citations92
US6457811B1Oct 1, 2002
Self-aligned interconnect and method for producing same
HEWLETT PACKARD CO27 citations92
US5008689AApr 16, 1991
Plastic substrate for thermal ink jet printer
HEWLETT PACKARD CO48 citations92
US6443557B1Sep 3, 2002
Chip-carrier for improved drop directionality
HEWLETT PACKARD CO12 citations74
US5993917ANov 30, 1999
Method and apparatus for improving wettability of foam
HEWLETT PACKARD CO16 citations73
PAN ALFRED I-TSUNG
4 patentsUS8651624B2Feb 18, 2014
Fluid ejector structure
PAN ALFRED I-TSUNG12 citations83
US8573749B2Nov 5, 2013
Printhead for generating ink drops with reduced tails
PAN ALFRED I-TSUNG2 citations61
US8425787B2Apr 23, 2013
Inkjet printhead bridge beam fabrication method
PAN ALFRED I-TSUNG3 citations54
US8419169B2Apr 16, 2013
Inkjet printhead and method employing central ink feed channel
PAN ALFRED I-TSUNG0 citations41