Inventor
SCHWAN CHRISTOPH
DE23 patents
⚠️ This page may combine multiple inventors who share the name “SCHWAN CHRISTOPH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED MICRO DEVICES INC
14 patentsUS6696334B1Feb 24, 2004
Method for formation of a differential offset spacer
ADVANCED MICRO DEVICES INC55 citations96
US7064071B2Jun 20, 2006
Method of forming a conformal spacer adjacent to a gate electrode structure
ADVANCED MICRO DEVICES INC41 citations92
US7838359B2Nov 23, 2010
Technique for forming contact insulation layers and silicide regions with different characteristics
ADVANCED MICRO DEVICES INC10 citations84
US7192881B2Mar 20, 2007
Method of forming sidewall spacer elements for a circuit element by increasing an etch selectivity
ADVANCED MICRO DEVICES INC14 citations84
US7547610B2Jun 16, 2009
Method of making a semiconductor device comprising isolation trenches inducing different types of strain
ADVANCED MICRO DEVICES INC11 citations83
US6579801B1Jun 17, 2003
Method for enhancing shallow trench top corner rounding using endpoint control of nitride layer etch process with appropriate etch front
ADVANCED MICRO DEVICES INC18 citations83
US7556996B2Jul 7, 2009
Field effect transistor comprising a stressed channel region and method of forming the same
ADVANCED MICRO DEVICES INC7 citations73
US7098140B2Aug 29, 2006
Method of compensating for etch rate non-uniformities by ion implantation
ADVANCED MICRO DEVICES INC10 citations73
US7005305B2Feb 28, 2006
Signal layer for generating characteristic optical plasma emissions
ADVANCED MICRO DEVICES INC7 citations73
US7005358B2Feb 28, 2006
Technique for forming recessed sidewall spacers for a polysilicon line
ADVANCED MICRO DEVICES INC9 citations73
US6969676B2Nov 29, 2005
Method of adjusting etch selectivity by adapting aspect ratios in a multi-level etch process
ADVANCED MICRO DEVICES INC11 citations73
US7838354B2Nov 23, 2010
Method for patterning contact etch stop layers by using a planarization process
ADVANCED MICRO DEVICES INC2 citations63
US7338872B2Mar 4, 2008
Method of depositing a layer of a material on a substrate
ADVANCED MICRO DEVICES INC2 citations63
US7563731B2Jul 21, 2009
Field effect transistor having a stressed dielectric layer based on an enhanced device topography
ADVANCED MICRO DEVICES INC0 citations52
KURZ ANDREAS
4 patentsUS8564089B2Oct 22, 2013
Electronic fuse structure formed using a metal gate electrode material stack configuration
KURZ ANDREAS6 citations73
US8617940B2Dec 31, 2013
SOI device with a buried insulating material having increased etch resistivity
KURZ ANDREAS5 citations72
US8609485B2Dec 17, 2013
Methods of forming efuse devices
KURZ ANDREAS1 citations52
US8193066B2Jun 5, 2012
Semiconductor device comprising a silicon/germanium resistor
KURZ ANDREAS0 citations41