P

Inventor

SCHWAN CHRISTOPH

DE23 patents
⚠️ This page may combine multiple inventors who share the name “SCHWAN CHRISTOPH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ADVANCED MICRO DEVICES INC

14 patents
US6696334B1Feb 24, 2004

Method for formation of a differential offset spacer

ADVANCED MICRO DEVICES INC55 citations96
US7064071B2Jun 20, 2006

Method of forming a conformal spacer adjacent to a gate electrode structure

ADVANCED MICRO DEVICES INC41 citations92
US7838359B2Nov 23, 2010

Technique for forming contact insulation layers and silicide regions with different characteristics

ADVANCED MICRO DEVICES INC10 citations84
US7192881B2Mar 20, 2007

Method of forming sidewall spacer elements for a circuit element by increasing an etch selectivity

ADVANCED MICRO DEVICES INC14 citations84
US7547610B2Jun 16, 2009

Method of making a semiconductor device comprising isolation trenches inducing different types of strain

ADVANCED MICRO DEVICES INC11 citations83
US6579801B1Jun 17, 2003

Method for enhancing shallow trench top corner rounding using endpoint control of nitride layer etch process with appropriate etch front

ADVANCED MICRO DEVICES INC18 citations83
US7556996B2Jul 7, 2009

Field effect transistor comprising a stressed channel region and method of forming the same

ADVANCED MICRO DEVICES INC7 citations73
US7098140B2Aug 29, 2006

Method of compensating for etch rate non-uniformities by ion implantation

ADVANCED MICRO DEVICES INC10 citations73
US7005305B2Feb 28, 2006

Signal layer for generating characteristic optical plasma emissions

ADVANCED MICRO DEVICES INC7 citations73
US7005358B2Feb 28, 2006

Technique for forming recessed sidewall spacers for a polysilicon line

ADVANCED MICRO DEVICES INC9 citations73
US6969676B2Nov 29, 2005

Method of adjusting etch selectivity by adapting aspect ratios in a multi-level etch process

ADVANCED MICRO DEVICES INC11 citations73
US7838354B2Nov 23, 2010

Method for patterning contact etch stop layers by using a planarization process

ADVANCED MICRO DEVICES INC2 citations63
US7338872B2Mar 4, 2008

Method of depositing a layer of a material on a substrate

ADVANCED MICRO DEVICES INC2 citations63
US7563731B2Jul 21, 2009

Field effect transistor having a stressed dielectric layer based on an enhanced device topography

ADVANCED MICRO DEVICES INC0 citations52

KURZ ANDREAS

4 patents

SCHWAN CHRISTOPH

2 patents

GLOBALFOUNDRIES INC

2 patents

GRIEBENOW UWE

1 patent