Inventor
KIM BYUNG-HO
KR25 patents
⚠️ This page may combine multiple inventors who share the name “KIM BYUNG-HO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
15 patentsUS10770416B2Sep 8, 2020
Semiconductor package
SAMSUNG ELECTRONICS CO LTD10 citations83
US10008398B2Jun 26, 2018
Substrate thinning apparatus, method of thinning substrate by using the same, and method of fabricating semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations72
US9811265B2Nov 7, 2017
Buffer memory devices, memory modules and solid state disks with non-uniform memory device connections
SAMSUNG ELECTRONICS CO LTD4 citations72
US10078198B2Sep 18, 2018
Photographing apparatus for automatically determining a focus area and a control method thereof
SAMSUNG ELECTRONICS CO LTD4 citations71
US10515916B2Dec 24, 2019
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations70
US11476215B2Oct 18, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US11011485B2May 18, 2021
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations62
US10824580B2Nov 3, 2020
Semiconductor device
SAMSUNG ELECTRONICS CO LTD1 citations62
US10622273B2Apr 14, 2020
Semiconductor package with improved flatness of an insulating layer formed on patterns
SAMSUNG ELECTRONICS CO LTD1 citations62
US10491826B2Nov 26, 2019
Method for obtaining panning shot image and electronic device supporting the same
SAMSUNG ELECTRONICS CO LTD1 citations62
US10389951B2Aug 20, 2019
Method for processing image and electronic device supporting the same
SAMSUNG ELECTRONICS CO LTD1 citations62
US10090835B2Oct 2, 2018
On-die termination circuit, a memory device including the on-die termination circuit, and a memory system including the memory device
SAMSUNG ELECTRONICS CO LTD1 citations51
US10741448B2Aug 11, 2020
Method of singulating semiconductor die and method of fabricating semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations42
US10872863B2Dec 22, 2020
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations41
US10402620B2Sep 3, 2019
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations41
DONGBU HITEK CO LTD
3 patentsUS7595254B2Sep 29, 2009
Method of manufacturing a semiconductor device
DONGBU HITEK CO LTD0 citations51
US7589011B2Sep 15, 2009
Semiconductor device and method of forming intermetal dielectric layer
DONGBU HITEK CO LTD0 citations51
US7713830B2May 11, 2010
Method of forming poly pattern in R-string of LCD drive IC and structure of the same
DONGBU HITEK CO LTD0 citations41