P

Inventor

KIM BYUNG-HO

KR25 patents
⚠️ This page may combine multiple inventors who share the name “KIM BYUNG-HO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

15 patents
US10770416B2Sep 8, 2020

Semiconductor package

SAMSUNG ELECTRONICS CO LTD10 citations83
US10008398B2Jun 26, 2018

Substrate thinning apparatus, method of thinning substrate by using the same, and method of fabricating semiconductor package

SAMSUNG ELECTRONICS CO LTD2 citations72
US9811265B2Nov 7, 2017

Buffer memory devices, memory modules and solid state disks with non-uniform memory device connections

SAMSUNG ELECTRONICS CO LTD4 citations72
US10078198B2Sep 18, 2018

Photographing apparatus for automatically determining a focus area and a control method thereof

SAMSUNG ELECTRONICS CO LTD4 citations71
US10515916B2Dec 24, 2019

Fan-out semiconductor package

SAMSUNG ELECTRONICS CO LTD2 citations70
US11476215B2Oct 18, 2022

Semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations62
US11011485B2May 18, 2021

Semiconductor package

SAMSUNG ELECTRONICS CO LTD1 citations62
US10824580B2Nov 3, 2020

Semiconductor device

SAMSUNG ELECTRONICS CO LTD1 citations62
US10622273B2Apr 14, 2020

Semiconductor package with improved flatness of an insulating layer formed on patterns

SAMSUNG ELECTRONICS CO LTD1 citations62
US10491826B2Nov 26, 2019

Method for obtaining panning shot image and electronic device supporting the same

SAMSUNG ELECTRONICS CO LTD1 citations62
US10389951B2Aug 20, 2019

Method for processing image and electronic device supporting the same

SAMSUNG ELECTRONICS CO LTD1 citations62
US10090835B2Oct 2, 2018

On-die termination circuit, a memory device including the on-die termination circuit, and a memory system including the memory device

SAMSUNG ELECTRONICS CO LTD1 citations51
US10741448B2Aug 11, 2020

Method of singulating semiconductor die and method of fabricating semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations42
US10872863B2Dec 22, 2020

Semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations41
US10402620B2Sep 3, 2019

Fan-out semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations41

DONGBU HITEK CO LTD

3 patents

OH GUN-SEOK

2 patents

JUNG MIN-SEOK

1 patent

SAMSUNG ELECTRO MECH

1 patent

NAM HO-YUN

1 patent

PARK JI WOON

1 patent

C&C RES LAB

1 patent