Inventor
SCHIECK BRIAN
US3 patents
Patents
3 patentsUS10032692B2Jul 24, 2018
Semiconductor package structure
NVIDIA CORP3 citations68
US11495568B2Nov 8, 2022
IC package design and methodology to compensate for die-substrate CTE mismatch at reflow temperatures
NVIDIA CORP0 citations54
US10943882B1Mar 9, 2021
IC package design and methodology to compensate for die-substrate CTE mismatch at reflow temperatures
NVIDIA CORP0 citations54