Inventor
NITTA NORZAFRIZA
JP2 patents
Patents
2 patentsUS12374646B2Jul 29, 2025
Bonding film, tape for wafer processing, method for producing bonded body, and bonded body and pasted body
FURUKAWA ELECTRIC CO LTD0 citations56
US11466181B2Oct 11, 2022
Metal particle-containing composition and electrically conductive adhesive film
FURUKAWA ELECTRIC CO LTD0 citations46