P

Inventor

KIM YOUNGSUK

KR58 patents
⚠️ This page may combine multiple inventors who share the name “KIM YOUNGSUK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DISCO CORP

29 patents
US12288682B2Apr 29, 2025

Processing method of wafer

DISCO CORP8 citations86
US11164802B2Nov 2, 2021

Wafer manufacturing method and multilayer device chip manufacturing method

DISCO CORP2 citations72
US10937668B2Mar 2, 2021

Semiconductor package manufacturing method

DISCO CORP3 citations72
US10403520B2Sep 3, 2019

Multi-blade and processing method of workpiece

DISCO CORP3 citations68
US11183464B2Nov 23, 2021

Package substrate processing method and protective tape

DISCO CORP1 citations62
US10707176B2Jul 7, 2020

Method of manufacturing semiconductor package

DISCO CORP1 citations62
US10700014B2Jun 30, 2020

Method of manufacturing semiconductor package

DISCO CORP1 citations62
US10211164B2Feb 19, 2019

Semiconductor package manufacturing method

DISCO CORP1 citations62
US11935863B2Mar 19, 2024

Laser reflow apparatus and laser reflow method

DISCO CORP1 citations61
US11607771B2Mar 21, 2023

Wafer processing apparatus

DISCO CORP0 citations52
US10957542B2Mar 23, 2021

Method of processing wafer

DISCO CORP0 citations52
US10586699B2Mar 10, 2020

Method of assessing semiconductor substrate and method of assessing device chip

DISCO CORP0 citations52
US12317653B2May 27, 2025

Method of manufacturing LED display panel

DISCO CORP0 citations51
US11682569B2Jun 20, 2023

Workpiece cutting method

DISCO CORP0 citations51
US11322476B2May 3, 2022

Manufacturing method of producing shielded individual semiconductor packages

DISCO CORP0 citations51
US11289348B2Mar 29, 2022

Workpiece processing method

DISCO CORP0 citations51
US11133198B2Sep 28, 2021

Method of manufacturing packaged device chip

DISCO CORP0 citations51
US11114385B2Sep 7, 2021

Plate-shaped workpiece processing method

DISCO CORP0 citations51
US12300545B2May 13, 2025

Wafer manufacturing method and laminated device chip manufacturing method

DISCO CORP0 citations50
US12198990B2Jan 14, 2025

Wafer manufacturing method and laminated device chip manufacturing method

DISCO CORP0 citations50
US11854891B2Dec 26, 2023

Wafer manufacturing method and laminated device chip manufacturing method

DISCO CORP0 citations50
US11764114B2Sep 19, 2023

Wafer manufacturing method and laminated device chip manufacturing method

DISCO CORP0 citations50
US11764115B2Sep 19, 2023

Wafer manufacturing method and laminated device chip manufacturing method

DISCO CORP0 citations50
US11756831B2Sep 12, 2023

Wafer manufacturing method and laminated device chip manufacturing method

DISCO CORP0 citations50
US11590629B2Feb 28, 2023

Method of processing workpiece and resin sheet unit

DISCO CORP0 citations50
US11508607B2Nov 22, 2022

Method of processing workpiece and resin sheet unit

DISCO CORP0 citations50
US10957593B2Mar 23, 2021

Method of processing a wafer

DISCO CORP0 citations49
US12474217B2Nov 18, 2025

Inspection method

DISCO CORP0 citations48
US10861716B2Dec 8, 2020

Processing method for package substrate

DISCO CORP0 citations41

LG ELECTRONICS INC

15 patents

LG CHEMICAL LTD

3 patents

KWON IG GEUN

2 patents

KIM YOUNGSUK

1 patent

Showing the top 50 of 58 patents by PatentIndex Score.