Inventor
TANDON SHALABH
US5 patents
Patents
5 patentsUS9953934B2Apr 24, 2018
Warpage controlled package and method for same
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US9659908B1May 23, 2017
Systems and methods for package on package through mold interconnects
INTEL CORP4 citations69
US11276625B2Mar 15, 2022
Methods of forming flexure based cooling solutions for package structures
INTEL CORP0 citations59
US7119314B2Oct 10, 2006
Radio frequency and microwave radiation used in conjunction with convective thermal heating to expedite curing of an imprinted material
INTEL CORP3 citations58
US7518091B2Apr 14, 2009
Radio frequency and microwave radiation used in conjunction with convective thermal heating to expedite curing of an imprinted material
INTEL CORP1 citations48