Inventor

HORITA MANABU

JP3 patents

Patents

3 patents

US5500502AMar 19, 1996

Bonding method and apparatus

MITSUBISHI ELECTRIC CORP30 citations90

US6614101B2Sep 2, 2003

Lead frame with raised leads and plastic packaged semiconductor device using the same

MITSUBISHI ELECTRIC CORP8 citations71

US10192811B2Jan 29, 2019

Power semiconductor device

MITSUBISHI ELECTRIC CORP1 citations60