Inventor

MIYAKAWA TAKUYA

JP35 patents

⚠️ This page may combine multiple inventors who share the name “MIYAKAWA TAKUYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MIYAKAWA TAKUYA

SEIKO EPSON CORP

Surface treatment method

Plasma etching method and method of manufacturing liquid crystal display panel

Surface treatment apparatus

Method of making a piezoelectric element

Method and apparatus for bonding using brazing material

Method and apparatus for atmospheric pressure plasma surface treatment, method of manufacturing semiconductor device, and method of manufacturing ink jet printing head

Method and apparatus for solid bonding, a conductor bonding method, a packaging method, and a bonding agent and a method for manufacturing a bonding agent

Brazing or soldering material and manufacturing method therefor

Method and apparatus for bonding using brazing material

Method of forming a film of predetermined pattern on a surface as well as device manufactured by employing the same, and method of manufacturing device

Electro-optical device and electronic apparatus

Mask forming and removing method, and semiconductor device, an electric circuit, a display module, a color filter and an emissive device manufactured by the same method

Method and apparatus for solid bonding, a conductor bonding method, a packaging method, and a bonding agent and a method for manufacturing a bonding agent

Head member ink repellence treating method and treating device

Piezoelectric element, manufacturing method thereof, and mounting apparatus of piezoelectric resonators

Electro-optical device and electronic apparatus

Formation method for metal element, production method for semiconductor device, production method for electronic device, semiconductor device, electronic device, and electronic equipment

Brazing or soldering material and production method thereof

Atomic cell, method for manufacturing atomic cell, and quantum interference device

Atomic cell, atomic cell manufacturing method, quantum interference device, atomic oscillator, electronic apparatus, and vehicle

Method and apparatus for solid bonding, a conductor bonding method, a packaging method, and a bonding agent and a method for manufacturing a bonding agent

Head member, method for ink-repellent treatment and apparatus for the same

Coating apparatus and coating method using the same

Method for manufacturing coated metal powder

Magnetic powder, method for producing magnetic powder, powder magnetic core, and coil part

Medium transport device, printing apparatus, and method for manufacturing medium transport device

Method for forming pattern, method for manufacturing ornament, method for manufacturing belt for wristwatch, method for manufacturing structure for mounting wiring, method for manufacturing semiconductor device, and method for manufacturing printed circuit board

Electro-optical device and electronic apparatus

Method for forming a transparent electrode film

Head member, method for ink-repellent treatment and apparatus for the same

Nozzle plate, liquid ejecting head, liquid ejecting apparatus, and method of manufacturing nozzle plate

Ink jet printer and control method thereof

Ink jet printer

Ink jet printer and printing method

YAZAKI CORP

Carbide dispersed, strengthened copper alloy