Inventor

DE FELIPE TAREK SUWWAN

US2 patents

Patents

2 patents

US6566246B1May 20, 2003

Deposition of conformal copper seed layers by control of barrier layer morphology

NOVELLUS SYSTEMS INC147 citations97

US6541374B1Apr 1, 2003

Method of depositing a diffusion barrier for copper interconnection applications

NOVELLUS SYSTEMS INC85 citations96