Inventor
TSAI NIEN-YU
TW21 patents
⚠️ This page may combine multiple inventors who share the name “TSAI NIEN-YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
12 patentsUS9514266B2Dec 6, 2016
Method and system of determining colorability of a layout
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US11106852B2Aug 31, 2021
Standard cell and semiconductor device including anchor nodes and method of making
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10713407B2Jul 14, 2020
Standard cell and semiconductor device including anchor nodes
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10162928B2Dec 25, 2018
Method of designing a semiconductor device, system for implementing the method and standard cell
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10430544B2Oct 1, 2019
Multi-patterning graph reduction and checking flow method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US12223251B2Feb 11, 2025
Standard cell and semiconductor device including anchor nodes
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12165969B2Dec 10, 2024
Integrated circuit device and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11714946B2Aug 1, 2023
Standard cell and semiconductor device including anchor nodes and method of making
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11681850B2Jun 20, 2023
Multi-patterning graph reduction and checking flow method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11017148B2May 25, 2021
Multi-patterning graph reduction and checking flow method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US9038010B2May 19, 2015
DRC format for stacked CMOS design
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations49
US10121694B2Nov 6, 2018
Methods of manufacturing a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations41
PROMOS TECHNOLOGIES INC
6 patentsUS6143653ANov 7, 2000
Method of forming tungsten interconnect with tungsten oxidation to prevent tungsten loss
PROMOS TECHNOLOGIES INC25 citations91
US6410417B1Jun 25, 2002
Method of forming tungsten interconnect and vias without tungsten loss during wet stripping of photoresist polymer
PROMOS TECHNOLOGIES INC11 citations72
US6743726B2Jun 1, 2004
Method for etching a trench through an anti-reflective coating
PROMOS TECHNOLOGIES INC10 citations68
US6312983B1Nov 6, 2001
Etching method for reducing bit line coupling in a DRAM
PROMOS TECHNOLOGIES INC6 citations61
US6514817B1Feb 4, 2003
Method of forming shallow trench
PROMOS TECHNOLOGIES INC3 citations60
US6998277B2Feb 14, 2006
Method of planarizing spin-on material layer and manufacturing photoresist layer
PROMOS TECHNOLOGIES INC2 citations53