Inventor
LAM KAN WAE
HK10 patents
⚠️ This page may combine multiple inventors who share the name “LAM KAN WAE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
Nexperia BV
8 patentsUS9640463B2May 2, 2017
Built-up lead frame package and method of making thereof
Nexperia BV7 citations81
US10410941B2Sep 10, 2019
Wafer level semiconductor device with wettable flanks
Nexperia BV6 citations70
US10304759B2May 28, 2019
Electronic device and method of making same
Nexperia BV2 citations70
US9847283B1Dec 19, 2017
Semiconductor device with wettable corner leads
Nexperia BV6 citations66
US11227820B2Jan 18, 2022
Through hole side wettable flank
Nexperia BV1 citations57
US10262926B2Apr 16, 2019
Reversible semiconductor die
Nexperia BV1 citations57
US10056343B2Aug 21, 2018
Packaged semiconductor device with interior polygonal pads
Nexperia BV0 citations45
US10256168B2Apr 9, 2019
Semiconductor device and lead frame therefor
Nexperia BV0 citations35