P

Inventor

LEUNG CHI HO

HK12 patents
⚠️ This page may combine multiple inventors who share the name “LEUNG CHI HO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

Nexperia BV

8 patents
US9640463B2May 2, 2017

Built-up lead frame package and method of making thereof

Nexperia BV7 citations81
US10410941B2Sep 10, 2019

Wafer level semiconductor device with wettable flanks

Nexperia BV6 citations70
US10304759B2May 28, 2019

Electronic device and method of making same

Nexperia BV2 citations70
US10262926B2Apr 16, 2019

Reversible semiconductor die

Nexperia BV1 citations57
US10658274B2May 19, 2020

Electronic device

Nexperia BV0 citations39
US10529644B2Jan 7, 2020

Semiconductor device

Nexperia BV0 citations37
US10256168B2Apr 9, 2019

Semiconductor device and lead frame therefor

Nexperia BV0 citations35
US9947632B2Apr 17, 2018

Semiconductor device and method of making a semiconductor device

Nexperia BV0 citations34

NXP BV

3 patents
US9391007B1Jul 12, 2016

Built-up lead frame QFN and DFN packages and method of making thereof

NXP BV10 citations81
US9443791B2Sep 13, 2016

Leadless semiconductor package and method

NXP BV7 citations76
US9425130B2Aug 23, 2016

Package with multiple I/O side-solderable terminals

NXP BV7 citations75

X ON COMMUNICATIONS LTD

1 patent
US9634739B2Apr 25, 2017

Wireless communication system and method thereof

X ON COMMUNICATIONS LTD0 citations25