Inventor
SAX HARRY WALTER
DE3 patents
Patents
3 patentsUS12040288B2Jul 16, 2024
Chip package and method of forming a chip package
INFINEON TECHNOLOGIES AG0 citations59
US11735534B2Aug 22, 2023
Chip package and method of forming a chip package
INFINEON TECHNOLOGIES AG0 citations59
US12489017B2Dec 2, 2025
Method of manufacturing a semiconductor package, die, and die package
INFINEON TECHNOLOGIES AG0 citations51