Inventor
TSENG I-HSIEN
TW10 patents
⚠️ This page may combine multiple inventors who share the name “TSENG I-HSIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
WINBOND ELECTRONICS CORP
8 patentsUS9691980B1Jun 27, 2017
Method for forming memory device
WINBOND ELECTRONICS CORP11 citations82
US9627059B2Apr 18, 2017
Resistive memory and data writing method for memory cell thereof
WINBOND ELECTRONICS CORP2 citations71
US10347336B1Jul 9, 2019
Method for obtaining optimal operating condition of resistive random access memory
WINBOND ELECTRONICS CORP2 citations70
US10643698B2May 5, 2020
Operating method of resistive memory storage apparatus
WINBOND ELECTRONICS CORP0 citations50
US9620208B2Apr 11, 2017
Devices and methods for programming a resistive random-access memory
WINBOND ELECTRONICS CORP1 citations50
US12374398B2Jul 29, 2025
Forming operation of resistive memory device
WINBOND ELECTRONICS CORP0 citations49
US9543010B2Jan 10, 2017
Resistive memory and measurement system thereof
WINBOND ELECTRONICS CORP0 citations40
US10490275B2Nov 26, 2019
Resistive memory storage apparatus and writing method thereof including disturbance voltage
WINBOND ELECTRONICS CORP0 citations39