Inventor

HOSSEINI KHALIL

DE82 patents

⚠️ This page may combine multiple inventors who share the name “HOSSEINI KHALIL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HOSSEINI KHALIL

INFINEON TECHNOLOGIES AG

Chip package with passives

Power semiconductor component stack using lead technology with surface-mountable external contacts and a method for producing the same

Semiconductor power component with a vertical current path through a semiconductor power chip

Power semiconductor device

Diffusion solder position, and process for producing it

Integrated circuit component with passivation layer

Power semiconductor component with a power semiconductor chip and method for producing the same

Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit

Semiconductor device having a clip contact

Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same

Method of manufacturing a chip package, chip package, method of manufacturing a chip assembly and chip assembly

Semiconductor device and method for producing the same

Micromechanical semiconductor sensing device

Chip package with embedded passive component

Electronic circuit arrangement

Semiconductor device comprising a semiconductor chip stack and method for producing the same

Layer between interfaces of different components in semiconductor devices

Semiconductor component comprising a semiconductor chip and semiconductor component carrier with external connection strips

Method for the planar joining of components of semiconductor devices and a diffusion joining structure

Semiconductor device having surface mountable external contact areas and method for producing the same

Method for manufacturing a chip arrangement including a ceramic layer

Electronic device and method for production

Semiconductor device with encapsulant

HOSSEINI KHALIL

Device including two power semiconductor chips and manufacturing thereof

Electronic device and method for production

Electronic device and method of fabricating an electronic device

Electric device package and method of making an electric device package

Electronic device and method for production

Chip carrier

Electronic device and method for fabricating an electronic device

Circuit package, an electronic circuit package, and methods for encapsulating an electronic circuit

MENGEL MANFRED

Chip-package and a method for forming a chip-package

Method and system for improving reliability of a semiconductor device

Device and method for manufacturing a device

Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a chip-packaging module and a packaging module

Method and system for minimizing carrier stress of a semiconductor device

INFINEON TECHNOLOGIES AUSTRIA

Multichip device

Device including a semiconductor chip and wires

Electronic device

Packaged semiconductor device having an embedded system

MAHLER JOACHIM

Electric device package comprising a laminate and method of making an electric device package comprising a laminate

Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package

Device contact, electric device package and method of manufacturing an electric device package

Integrated circuits and a method for manufacturing an integrated circuit

FUERGUT EDWARD

Semiconductor package and methods of formation thereof

Semiconductor packages and methods of formation thereof

INFINEON TECHNOLOGIES AUSTRIA AG

Electronic power device and method of fabricating an electronic power device

Package and a method of manufacturing the same

KALZ FRANZ-PETER

Micromechanical semiconductor sensing device

GALESIC IVAN

Electronic component with buffer layer