Inventor
BAI MO
US3 patents
Patents
3 patentsUS10117357B2Oct 30, 2018
Stationary cooling structure for board/chassis-level conduction cooling
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US9813082B2Nov 7, 2017
Heat spreader with thermally coductive foam core
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US10292308B2May 14, 2019
Fluid coupling mating apparatus and method
FUTUREWEI TECHNOLOGIES INC0 citations37