Inventor
LEE JANGGEUN
US4 patents
⚠️ This page may combine multiple inventors who share the name “LEE JANGGEUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
3 patentsUS12564036B2Feb 24, 2026
Integrated circuit devices including via structures having a narrow upper portion, and related fabrication methods
SAMSUNG ELECTRONICS CO LTD0 citations59
US12347774B2Jul 1, 2025
Integrated circuit devices including metal lines spaced apart from metal vias, and related fabrication methods
SAMSUNG ELECTRONICS CO LTD0 citations58
US12588489B2Mar 24, 2026
Integrated circuit devices including stacked elements and methods of forming the same
SAMSUNG ELECTRONICS CO LTD0 citations47