Inventor

GEKTIN VADIM

US25 patents

⚠️ This page may combine multiple inventors who share the name “GEKTIN VADIM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GEKTIN VADIM

SUN MICROSYSTEMS INC

Heatsink with active liquid base

Conformal heat spreader

Method and apparatus for force transfer via bare die package

Package lid or heat spreader for microprocessor packages

Gasketed field-replaceable active integrated liquid pump heat sink module for thermal management of electronic components

Multi-material heat spreader

Multi-lid semiconductor package

System for facilitating alignment of silicon die

Apparatus and methods for enhancing thermal performance of integrated circuit packages

Facilitating heat transfer from an integrated circuit package

FUTUREWEI TECHNOLOGIES INC

Apparatus and method for a back plate for heat sink mounting

Stationary cooling structure for board/chassis-level conduction cooling

Thermal management in 2.5 D semiconductor packaging

Heat spreader with thermally coductive foam core

Optical communication component cooling

Charger having retractable cooling surface

Fluid coupling mating apparatus and method

Centralized chassis architecture for half-width boards

ORACLE AMERICA INC

Optimized lid attach process for thermal management and multi-surface compliant heat removal

Composite interconnect

Metallic thermal joint for high power density chips

GEKTIN VADIM

Optimized lid attach process for thermal management and multi-surface compliant heat removal

Carbon nanotube based interposer

ANKIREDDI SESHASAYEE

Thermal and power bus stacked package architecture

JIN YOULIN

Chassis with adjustable baffle for cooling