Inventor

GRUBER MARTIN

DE61 patents

⚠️ This page may combine multiple inventors who share the name “GRUBER MARTIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GRUBER MARTIN

INFINEON TECHNOLOGIES AG

Optical semiconductor component with an optically transparent protective layer

Stacked die semiconductor package with electrical interposer

Circuit board embedding a power semiconductor chip

Plurality of transistor packages with exposed source and drain contacts mounted on a carrier

Method for producing a chip assemblage

Semiconductor package with integrated magnetic field sensor

Semiconductor package

Semiconductor package and method of forming a semiconductor package

Processing of one or more carrier bodies and electronic components by multiple alignment

Silicon carbide device and method for forming a silicon carbide device

Semiconductor device comprising a composite material clip

Semiconductor package system

Semiconductor device having a carrier, semiconductor chip packages mounted on the carrier and a cooling element

Semiconductor package having a lead frame and a clip frame

Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture

Multi-functional interconnect module and carrier with multi-functional interconnect module attached thereto

Semiconductor packages including electrical redistribution layers of different thicknesses and methods for manufacturing thereof

Batch manufacture of packages by sheet separated into carriers after mounting of electronic components

Power package having multiple mold compounds

Electronic module comprising fluid cooling channel and method of manufacturing the same

Integration of current measurement in wiring structure of an electronic circuit

Leadframe, encapsulated package with punched lead and sawn side flanks, and corresponding manufacturing method

Package with elevated lead and structure extending vertically from encapsulant bottom

Package with separate substrate sections

Method of galvanic plating assisted by a current distribution layer

INFINEON TECHNOLOGIES AUSTRIA AG

Electronic module comprising a plurality of encapsulation layers and a method for producing it

Switch device

Semiconductor package with connection lug

Semiconductor device having die pads with exposed surfaces

Electronic module including a semiconductor package disposed on an interposer layer

Method for fabricating a semiconductor device package comprising a pin in the form of a drilling screw

Semiconductor device module having vertical metallic contacts and a method for fabricating the same

Electronic module including a semiconductor package connected to a fluid heatsink

Semiconductor device package comprising a pin in the form of a drilling screw

Additive manufacturing of a frontside or backside interconnect of a semiconductor die

Magnetic current sensor

Semiconductor package with signal distribution element

Method for fabricating a semiconductor device including an embedded semiconductor die

Semiconductor device including an embedded semiconductor die

Electronic module comprising a semiconductor package with integrated clip and fastening element

Device for controlling trapped ions

Device for controlling trapped ions and method of manufacturing the same

Semiconductor device with improved performance in operation and improved flexibility in the arrangement of power chips

MANN & HUMMEL GMBH

Filter Element, in Particular for Gas Filtration, and filter device

Hollow filter element, in particular for gas filtration

Fluid filter element

Filter element, in particular for gas filtration

AUDI AG

Internal combustion engine and method for operating an internal combustion engine

Internal combustion engine and method for operating an internal combustion engine

GRUBER MARTIN

Ring