Inventor
BIN XIAOMIN
US5 patents
Patents
5 patentsUS8828863B1Sep 9, 2014
Electroless copper deposition with suppressor
LAM RES CORP6 citations69
US11384430B2Jul 12, 2022
Method for conditioning a ceramic coating
LAM RES CORP0 citations58
US9818617B2Nov 14, 2017
Method of electroless plating using a solution with at least two borane containing reducing agents
LAM RES CORP0 citations48
US9551074B2Jan 24, 2017
Electroless plating solution with at least two borane containing reducing agents
LAM RES CORP0 citations48
US9142416B1Sep 22, 2015
Process to reduce nodule formation in electroless plating
LAM RES CORP0 citations48