Inventor

HUANG HON-LIN

TW53 patents

⚠️ This page may combine multiple inventors who share the name “HUANG HON-LIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUANG HON-LIN

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor structure and method

Structure and formation method of semiconductor device with magnetic element

Structure and formation method of semiconductor device with magnetic element

Semiconductor device structure with magnetic element

Semiconductor device structure with magnetic element covered by polymer material

Semiconductor devices and methods of forming the same

Semiconductor devices and methods of forming the same

Interconnect structure and method of forming the same

Semiconductor device and method of forming the same

Semiconductor devices

Semiconductor device and bump formation process

Semiconductor devices and methods of forming the same

Semiconductor structure with resistor layer and method for forming the same

Semiconductor processing station

Semiconductor device structure with magnetic element

Semiconductor device structure with a protection cap at an end portion of a conductive line

Semiconductor device structure with magnetic element

Semiconductor device structure with magnetic element

Semiconductor device structure having protection caps on conductive lines

Semiconductor device structure with magnetic element

Semiconductor device structure with magnetic element

Semiconductor devices

Structure and formation method of semiconductor device with magnetic element covered by polymer material

Semiconductor device

Semiconductor device and method of forming the same

Semiconductor device

Semiconductor processing station and semiconductor process using the same

Method of forming semiconductor device

Semiconductor processing station

Semiconductor devices and methods of forming the same

Magnetic core inductor semiconductor structure and method

Semiconductor structure and method

Semiconductor device structure with magnetic layer and method for forming the same

Method of manufacturing an integrated inductor with protections caps on conductive lines

Semicondcutor device and manufacturing method thereof

Semiconductor structure with resistor layer and method for forming the same

Semiconductor structure and manufacturing method thereof

Semiconductor device and bump formation process

Semiconductor baking apparatus and operation method thereof

TAIWAN SEMICONDUCTOR MFG

Bond pad connection to redistribution lines having tapered profiles

Interconnect structure and method of forming the same

Front side copper post joint structure for temporary bond in TSV application

Die edge contacts for semiconductor devices

HUANG HON-LIN

Formation of TSV backside interconnects by modifying carrier wafers

Front side copper post joint structure for temporary bond in TSV application

TAIWAN SEMICONDUCTOR MANFACTUR

Introducing a metal layer between SiN and TiN to improve CBD contact resistance for P-TSV

YU CHEN-HUA

Wafer backside structures having copper pillars

HSU KUO-CHING

Bond pad connection to redistribution lines having tapered profiles

TSENG MING-HONG

Three-dimensional integrated circuit stacking-joint interface structure

LAI YI-JEN

Die edge contacts for semiconductor devices