Inventor
KIKUCHI Syougo
JP2 patents
Patents
2 patentsUS9868884B2Jan 16, 2018
Adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging element
HITACHI CHEMICAL CO LTD2 citations65
US10358580B2Jul 23, 2019
Adhesive composition, resin cured product obtained from adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging element
HITACHI CHEMICAL CO LTD1 citations55