Inventor

TSAI CHUN YUAN

TW3 patents

Patents

3 patents

US9922917B2Mar 20, 2018

Semiconductor package including substrates spaced by at least one electrical connecting element

ADVANCED SEMICONDUCTOR ENG5 citations79

US9443785B2Sep 13, 2016

Semiconductor package

ADVANCED SEMICONDUCTOR ENG4 citations68

US10032652B2Jul 24, 2018

Semiconductor package having improved package-on-package interconnection

ADVANCED SEMICONDUCTOR ENG4 citations62