Inventor
HIRANO SYUNSUKE
JP7 patents
Patents
7 patentsUS11664240B2May 30, 2023
Method for producing laminate having patterned metal foil, and laminate having patterned metal foil
MITSUBISHI GAS CHEMICAL CO0 citations59
US11217445B2Jan 4, 2022
Supporting substrate, supporting substrate-attached laminate and method for manufacturing a package substrate for mounting a semiconductor device
MITSUBISHI GAS CHEMICAL CO0 citations59
US12119277B2Oct 15, 2024
Method for producing package substrate for mounting semiconductor device
MITSUBISHI GAS CHEMICAL CO0 citations49
US11990349B2May 21, 2024
Method for producing package substrate for loading semiconductor device
MITSUBISHI GAS CHEMICAL CO0 citations49
US11877396B2Jan 16, 2024
Laminate, metal foil-clad laminate, laminate having patterned metal foil, laminate having buildup structure, printed wiring board, multilayer coreless substrate, and method for producing same
MITSUBISHI GAS CHEMICAL CO0 citations49
US11197379B2Dec 7, 2021
Method for producing printed wiring board
MITSUBISHI GAS CHEMICAL CO0 citations48
US10727081B2Jul 28, 2020
Method for manufacturing package substrate for mounting a semiconductor device, and method for manufacturing semiconductor device mounting substrate
MITSUBISHI GAS CHEMICAL CO0 citations38