P

Inventor

BERRY III IVAN L

US31 patents
⚠️ This page may combine multiple inventors who share the name “BERRY III IVAN L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LAM RES CORP

21 patents
US9431268B2Aug 30, 2016

Isotropic atomic layer etch for silicon and germanium oxides

LAM RES CORP135 citations98
US9425041B2Aug 23, 2016

Isotropic atomic layer etch for silicon oxides using no activation

LAM RES CORP143 citations97
US9779955B2Oct 3, 2017

Ion beam etching utilizing cryogenic wafer temperatures

LAM RES CORP21 citations94
US9536748B2Jan 3, 2017

Use of ion beam etching to generate gate-all-around structure

LAM RES CORP22 citations94
US9406535B2Aug 2, 2016

Ion injector and lens system for ion beam milling

LAM RES CORP33 citations94
US11062920B2Jul 13, 2021

Ion injector and lens system for ion beam milling

LAM RES CORP8 citations84
US9916993B2Mar 13, 2018

Ion injector and lens system for ion beam milling

LAM RES CORP9 citations84
US10580628B2Mar 3, 2020

Differentially pumped reactive gas injector

LAM RES CORP8 citations83
US9837254B2Dec 5, 2017

Differentially pumped reactive gas injector

LAM RES CORP12 citations83
US9812349B2Nov 7, 2017

Control of the incidence angle of an ion beam on a substrate

LAM RES CORP8 citations83
US11289306B2Mar 29, 2022

Ion beam etching utilizing cryogenic wafer temperatures

LAM RES CORP2 citations73
US10998167B2May 4, 2021

Ion beam etch without need for wafer tilt or rotation

LAM RES CORP3 citations73
US10825652B2Nov 3, 2020

Ion beam etch without need for wafer tilt or rotation

LAM RES CORP5 citations73
US10483085B2Nov 19, 2019

Use of ion beam etching to generate gate-all-around structure

LAM RES CORP2 citations73
US11520953B2Dec 6, 2022

Predicting etch characteristics in thermal etching and atomic layer etching

LAM RES CORP3 citations72
US10679868B2Jun 9, 2020

Isotropic atomic layer etch for silicon oxides using no activation

LAM RES CORP3 citations71
US9911620B2Mar 6, 2018

Method for achieving ultra-high selectivity while etching silicon nitride

LAM RES CORP3 citations71
US12302760B2May 13, 2025

Ion beam etching with sidewall cleaning

LAM RES CORP0 citations63
US12029133B2Jul 2, 2024

Ion beam etching with sidewall cleaning

LAM RES CORP0 citations63
US11637022B2Apr 25, 2023

Electron excitation atomic layer etch

LAM RES CORP1 citations63
US9740104B2Aug 22, 2017

Plasma dry strip pretreatment to enhance ion implanted resist removal

LAM RES CORP0 citations40

AXCELIS TECH INC

5 patents

DOW CORNING

2 patents

LAM RES AG

2 patents

MICRON TECHNOLOGY INC

1 patent