P

Inventor

LILL THORSTEN

US84 patents
⚠️ This page may combine multiple inventors who share the name “LILL THORSTEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LAM RES CORP

36 patents
US9806252B2Oct 31, 2017

Dry plasma etch method to pattern MRAM stack

LAM RES CORP61 citations98
US9431268B2Aug 30, 2016

Isotropic atomic layer etch for silicon and germanium oxides

LAM RES CORP135 citations98
US9805941B2Oct 31, 2017

Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch)

LAM RES CORP44 citations97
US9576811B2Feb 21, 2017

Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch)

LAM RES CORP65 citations97
US9257638B2Feb 9, 2016

Method to etch non-volatile metal materials

LAM RES CORP55 citations97
US9130158B1Sep 8, 2015

Method to etch non-volatile metal materials

LAM RES CORP44 citations97
US10374144B2Aug 6, 2019

Dry plasma etch method to pattern MRAM stack

LAM RES CORP21 citations94
US10186426B2Jan 22, 2019

Integrating atomic scale processes: ALD (atomic layer deposition) and ale (atomic layer etch)

LAM RES CORP16 citations94
US10096487B2Oct 9, 2018

Atomic layer etching of tungsten and other metals

LAM RES CORP24 citations94
US9779955B2Oct 3, 2017

Ion beam etching utilizing cryogenic wafer temperatures

LAM RES CORP21 citations94
US9536748B2Jan 3, 2017

Use of ion beam etching to generate gate-all-around structure

LAM RES CORP22 citations94
US9406535B2Aug 2, 2016

Ion injector and lens system for ion beam milling

LAM RES CORP33 citations94
US9870899B2Jan 16, 2018

Cobalt etch back

LAM RES CORP32 citations93
US9245761B2Jan 26, 2016

Internal plasma grid for semiconductor fabrication

LAM RES CORP21 citations92
US11062920B2Jul 13, 2021

Ion injector and lens system for ion beam milling

LAM RES CORP8 citations84
US10749103B2Aug 18, 2020

Dry plasma etch method to pattern MRAM stack

LAM RES CORP7 citations84
US10515816B2Dec 24, 2019

Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch)

LAM RES CORP6 citations84
US10403476B2Sep 3, 2019

Active showerhead

LAM RES CORP9 citations84
US10224221B2Mar 5, 2019

Internal plasma grid for semiconductor fabrication

LAM RES CORP7 citations84
US10141163B2Nov 27, 2018

Controlling ion energy within a plasma chamber

LAM RES CORP8 citations84
US9984858B2May 29, 2018

ALE smoothness: in and outside semiconductor industry

LAM RES CORP10 citations84
US9916993B2Mar 13, 2018

Ion injector and lens system for ion beam milling

LAM RES CORP9 citations84
US9460894B2Oct 4, 2016

Controlling ion energy within a plasma chamber

LAM RES CORP11 citations84
US10784086B2Sep 22, 2020

Cobalt etch back

LAM RES CORP9 citations83
US10580628B2Mar 3, 2020

Differentially pumped reactive gas injector

LAM RES CORP8 citations83
US9837254B2Dec 5, 2017

Differentially pumped reactive gas injector

LAM RES CORP12 citations83
US9953843B2Apr 24, 2018

Chamber for patterning non-volatile metals

LAM RES CORP15 citations82
US10256108B2Apr 9, 2019

Atomic layer etching of AL2O3 using a combination of plasma and vapor treatments

LAM RES CORP7 citations81
US9320387B2Apr 26, 2016

Sulfur doped carbon hard masks

LAM RES CORP6 citations80
US11380556B2Jul 5, 2022

Thermal atomic layer etch with rapid temperature cycling

LAM RES CORP3 citations73
US11289306B2Mar 29, 2022

Ion beam etching utilizing cryogenic wafer temperatures

LAM RES CORP2 citations73
US10998167B2May 4, 2021

Ion beam etch without need for wafer tilt or rotation

LAM RES CORP3 citations73
US10825652B2Nov 3, 2020

Ion beam etch without need for wafer tilt or rotation

LAM RES CORP5 citations73
US10804079B2Oct 13, 2020

Active showerhead

LAM RES CORP3 citations73
US10727073B2Jul 28, 2020

Atomic layer etching 3D structures: Si and SiGe and Ge smoothness on horizontal and vertical surfaces

LAM RES CORP5 citations73
US10692724B2Jun 23, 2020

Atomic layer etching methods and apparatus

LAM RES CORP3 citations73

APPLIED MATERIALS INC

13 patents
US9034199B2May 19, 2015

Ceramic article with reduced surface defect density and process for producing a ceramic article

APPLIED MATERIALS INC47 citations98
US6074954AJun 13, 2000

Process for control of the shape of the etch front in the etching of polysilicon

APPLIED MATERIALS INC155 citations98
US6518190B1Feb 11, 2003

Plasma reactor with dry clean apparatus and method

APPLIED MATERIALS INC42 citations93
US7067432B2Jun 27, 2006

Methodology for in-situ and real-time chamber condition monitoring and process recovery during plasma processing

APPLIED MATERIALS INC29 citations92
US6660127B2Dec 9, 2003

Apparatus for plasma etching at a constant etch rate

APPLIED MATERIALS INC26 citations92
US6632321B2Oct 14, 2003

Method and apparatus for monitoring and controlling wafer fabrication process

APPLIED MATERIALS INC21 citations92
US6613682B1Sep 2, 2003

Method for in situ removal of a dielectric antireflective coating during a gate etch process

APPLIED MATERIALS INC26 citations92
US6399507B1Jun 4, 2002

Stable plasma process for etching of films

APPLIED MATERIALS INC34 citations92
US6284665B1Sep 4, 2001

Method for controlling the shape of the etch front in the etching of polysilicon

APPLIED MATERIALS INC31 citations92
US6228208B1May 8, 2001

Plasma density and etch rate enhancing semiconductor processing chamber

APPLIED MATERIALS INC33 citations92
US8709953B2Apr 29, 2014

Pulsed plasma with low wafer temperature for ultra thin layer etches

APPLIED MATERIALS INC12 citations84
US9257293B2Feb 9, 2016

Methods of forming silicon nitride spacers

APPLIED MATERIALS INC10 citations82
US7846845B2Dec 7, 2010

Integrated method for removal of halogen residues from etched substrates in a processing system

APPLIED MATERIALS INC16 citations82

(unassigned)

1 patent

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