Inventor

WALCZYK JOE

US19 patents

⚠️ This page may combine multiple inventors who share the name “WALCZYK JOE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WALCZYK JOE

INTEL CORP

High density and fine pitch interconnect structures in an electric test apparatus

Slip-plane MEMs probe for high-density and fine pitch interconnects

Slip-plane MEMS probe for high-density and fine pitch interconnects

Hybrid backside thermal structures for enhanced IC packages

Hybrid thermal interface material (TIM) with reduced 3D thermal resistance

High density and fine pitch interconnect structures in an electric test apparatus

Conformable heat spreader

Integrated circuit die packages including a contiguous heat spreader

Electrical testing apparatus with lateral movement of a probe support substrate

Hybrid backside thermal structures for enhanced ic packages

Shielded interconnect array

Micro-coaxial wire interconnect architecture

High density and fine pitch interconnect structures in an electric test apparatus

Additively manufactured structures for heat dissipation from integrated circuit devices

Dual-sided socket device with corrugation structures and shield structures

Low profile edge clamp socket

Actuation mechanisms for electrical interconnections

Massively-parallel micronozzle array for direct write electrodeposition of high-density microstructure arrays

KIRBY RONALD

Seal method for direct liquid cooling of probes used at first level interconnect