Inventor
ZHAO BIN
CN321 patents
⚠️ This page may combine multiple inventors who share the name “ZHAO BIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEWPORT FAB LLC
9 patentsUS6509623B2Jan 21, 2003
Microelectronic air-gap structures and methods of forming the same
NEWPORT FAB LLC276 citations99
US6417094B1Jul 9, 2002
Dual-damascene interconnect structures and methods of fabricating same
NEWPORT FAB LLC94 citations98
US6984577B1Jan 10, 2006
Damascene interconnect structure and fabrication method having air gaps between metal lines and metal layers
NEWPORT FAB LLC61 citations96
US6627539B1Sep 30, 2003
Method of forming dual-damascene interconnect structures employing low-k dielectric materials
NEWPORT FAB LLC70 citations96
US7056822B1Jun 6, 2006
Method of fabricating an interconnect structure employing air gaps between metal lines and between metal layers
NEWPORT FAB LLC41 citations93
US6838352B1Jan 4, 2005
Damascene trench capacitor for mixed-signal/RF IC applications
NEWPORT FAB LLC25 citations93
US6740985B1May 25, 2004
Structure for bonding pad and method for its fabrication
NEWPORT FAB LLC36 citations93
US6444136B1Sep 3, 2002
Fabrication of improved low-k dielectric structures
NEWPORT FAB LLC46 citations92
US6396122B1May 28, 2002
Method for fabricating on-chip inductors and related structure
NEWPORT FAB LLC32 citations92
CONEXANT SYSTEMS INC
7 patentsUS6211561B1Apr 3, 2001
Interconnect structure and method employing air gaps between metal lines and between metal layers
CONEXANT SYSTEMS INC152 citations99
US6187672B1Feb 13, 2001
Interconnect with low dielectric constant insulators for semiconductor integrated circuit manufacturing
CONEXANT SYSTEMS INC512 citations99
US6245663B1Jun 12, 2001
IC interconnect structures and methods for making same
CONEXANT SYSTEMS INC129 citations98
US6198170B1Mar 6, 2001
Bonding pad and support structure and method for their fabrication
CONEXANT SYSTEMS INC109 citations98
US6271127B1Aug 7, 2001
Method for dual damascene process using electron beam and ion implantation cure methods for low dielectric constant materials
CONEXANT SYSTEMS INC101 citations97
US6329290B1Dec 11, 2001
Method for fabrication and structure for high aspect ratio vias
CONEXANT SYSTEMS INC23 citations93
US6280794B1Aug 28, 2001
Method of forming dielectric material suitable for microelectronic circuits
CONEXANT SYSTEMS INC30 citations92
FREESCALE SEMICONDUCTOR INC
5 patentsUS7843242B1Nov 30, 2010
Phase-shifted pulse width modulation signal generation
FREESCALE SEMICONDUCTOR INC24 citations93
US8049439B2Nov 1, 2011
LED driver with dynamic headroom control
FREESCALE SEMICONDUCTOR INC32 citations91
US7825610B2Nov 2, 2010
LED driver with dynamic power management
FREESCALE SEMICONDUCTOR INC30 citations91
US8035315B2Oct 11, 2011
LED driver with feedback calibration
FREESCALE SEMICONDUCTOR INC23 citations90
US8035314B2Oct 11, 2011
Method and device for LED channel managment in LED driver
FREESCALE SEMICONDUCTOR INC7 citations84
ZHAO BIN
5 patentsUS8115414B2Feb 14, 2012
LED driver with segmented dynamic headroom control
ZHAO BIN23 citations91
US8305007B2Nov 6, 2012
Analog-to-digital converter with non-uniform accuracy
ZHAO BIN9 citations84
US8179051B2May 15, 2012
Serial configuration for dynamic power control in LED displays
ZHAO BIN18 citations84
US8633680B2Jan 21, 2014
Differential sensing for voltage control in a power supply circuit
ZHAO BIN7 citations82
US8599915B2Dec 3, 2013
Phase-shifted pulse width modulation signal generation device and method therefor
ZHAO BIN9 citations82
WEBEX COMMUNICATIONS INC
4 patentsUS6567813B1May 20, 2003
Quality of service maintenance for distributed collaborative computing
WEBEX COMMUNICATIONS INC315 citations99
US7130883B2Oct 31, 2006
Distributed network system architecture for collaborative computing
WEBEX COMMUNICATIONS INC145 citations98
US7069298B2Jun 27, 2006
Fault-tolerant distributed system for collaborative computing
WEBEX COMMUNICATIONS INC135 citations98
US6925645B2Aug 2, 2005
Fault tolerant server architecture for collaborative computing
WEBEX COMMUNICATIONS INC140 citations98
CORNELL RES FOUNDATION INC
4 patentsUS5830805ANov 3, 1998
Electroless deposition equipment or apparatus and method of performing electroless deposition
CORNELL RES FOUNDATION INC358 citations99
US5891513AApr 6, 1999
Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications
CORNELL RES FOUNDATION INC582 citations98
US5695810ADec 9, 1997
Use of cobalt tungsten phosphide as a barrier material for copper metallization
CORNELL RES FOUNDATION INC833 citations97
US5824599AOct 20, 1998
Protected encapsulation of catalytic layer for electroless copper interconnect
CORNELL RES FOUNDATION INC561 citations96
SEMATECH INC
4 patentsUS6100184AAug 8, 2000
Method of making a dual damascene interconnect structure using low dielectric constant material for an inter-level dielectric layer
SEMATECH INC236 citations98
US6037664AMar 14, 2000
Dual damascene interconnect structure using low dielectric constant material for an inter-level dielectric layer
SEMATECH INC306 citations98
US5674787AOct 7, 1997
Selective electroless copper deposited interconnect plugs for ULSI applications
SEMATECH INC838 citations98
US5660706AAug 26, 1997
Electric field initiated electroless metal deposition
SEMATECH INC33 citations93
ARCSOFT INC
2 patentsSKYWORKS SOLUTIONS INC
1 patentROCKWELL SEMICONDUCTOR SYS INC
1 patentSEMATECH SARL
1 patentWISCONSIN ALUMNI RES FOUND
1 patentCISCO TECH INC
1 patentJIANGSU XCMG CONSTRUCTION MACHINERY RES INSTITUTE LTD
1 patentAGORA LAB INC
1 patentCIRVINE CORP
1 patentUNIV CARNEGIE MELLON
1 patentSMITH GALE
1 patentShowing the top 50 of 321 patents by PatentIndex Score.