Inventor
PARK WOO HYUN
KR5 patents
Patents
5 patentsUS10707196B2Jul 7, 2020
Electronic device and method of manufacturing the electronic device
SAMSUNG ELECTRONICS CO LTD9 citations82
US11205604B2Dec 21, 2021
Semiconductor package including a thermal conductive layer and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations71
US10964618B2Mar 30, 2021
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD3 citations69
US11004760B2May 11, 2021
Chip structure operating method including heating elements to reduce temperature variation
SAMSUNG ELECTRONICS CO LTD0 citations60
US10553513B2Feb 4, 2020
Chip structure including heating element
SAMSUNG ELECTRONICS CO LTD1 citations60