Inventor
JUNG EUNHEE
KR8 patents
Patents
8 patentsUS12062605B2Aug 13, 2024
Semiconductor package including an interposer and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD1 citations72
US11367679B2Jun 21, 2022
Semiconductor package including an in interposer and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD1 citations72
US11125734B2Sep 21, 2021
Gas sensor package
SAMSUNG ELECTRONICS CO LTD3 citations71
US10760930B2Sep 1, 2020
Sensor package, method of manufacturing the same, and method of manufacturing lid structure
SAMSUNG ELECTRONICS CO LTD2 citations70
US11658107B2May 23, 2023
Semiconductor package including an interposer and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US10923428B2Feb 16, 2021
Semiconductor package having second pad electrically connected through the interposer chip to the first pad
SAMSUNG ELECTRONICS CO LTD0 citations62
US11131568B2Sep 28, 2021
Sensor package, method of manufacturing the same, and method of manufacturing lid structure
SAMSUNG ELECTRONICS CO LTD0 citations59
US11067554B2Jul 20, 2021
Gas sensor package and sensing apparatus including the same
SAMSUNG ELECTRONICS CO LTD1 citations59