Inventor

HUANG HUNG-CHENG

TW6 patents

⚠️ This page may combine multiple inventors who share the name “HUANG HUNG-CHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ALI CORP

2 patents

US6762507B2Jul 13, 2004

Internal circuit structure of semiconductor chip with array-type bonding pads and method of fabricating the same

ALI CORP19 citations89

US6759329B2Jul 6, 2004

Internal circuit structure of semiconductor chip with array-type bonding pads and method of fabricating the same

ALI CORP4 citations60

NVIDIA CORP

2 patents

US7253599B2Aug 7, 2007

Bandgap reference circuit

NVIDIA CORP14 citations82

US7619401B2Nov 17, 2009

Bandgap reference circuit

NVIDIA CORP4 citations61

ACER LABS INC

1 patent

US6707164B2Mar 16, 2004

Package of semiconductor chip with array-type bonding pads

ACER LABS INC29 citations89

HUANG HUNG-CHENG

1 patent

US8107466B2Jan 31, 2012

Flexible network switch fabric for clustering system

HUANG HUNG-CHENG5 citations50